Chip Quik Smooth Flow Low Temp Solder Paste Sn42/Bi57.6/Ag0.4 T5 50g Jar

AED

267

.90

شامل ضريبة القيمة المضافة

أهم المميزات

This product is internationally sourced and shipped. Specifications and packaging may differ from local versions. Electronic items may include an international plug requiring a UAE-compatible adapter. Warranty, where applicable, is provided by the seller and may not be covered by the manufacturer.
708210651721
Chip Quik
50 Grams
Chip Quik

يتم بيعه وتوصيله من قِبَل: ShiftPlus

احصل عليه

التوصيل المجاني

الخميس, نوفمبر ١٩رابع - الجمعة, نوفمبر ٢٠رابع

الوصف

Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn42/Bi57. 6/Ag0. 4 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 89. 25% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 138C (281F) Size: 50g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.