Essmetuin Solder Paste (Sn42/Bi58 T5 20G) For Electronic Soldering, No-Clean Tin Paste, Soldering Paste For Chip kit/PCB/IC/BGA/SMD CELLPHONE CPU Repairing

Lead-Free Solder Paste : Tin 42% Bi 58%, Solder Flux Content: 10.8%, T5 Particle Size: 15-25 Microns, Melting Point: 138 ℃ (280.4F),Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, Special Welding Of Small Components, Pushing-Type Design Smoother Flowing No Wasting During Welding, The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated, Suitable Used In BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance