Thermal Grizzly Minus Pad 8100x100x10mm Thermal Interface Pad Electrically NonConductive High Thermal Conductivity Compressibility for SSDs GPUs Electronics

THERMAL CONDUCTIVE PAD It effectively dissipates significant amounts of heat thanks to its unique composition of Ceramic Silicone and NanoAluminum Oxide FLEXIBLE STRUCTURE The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity USED IN VARIOUS SCENARIOS It is utilized in situations where thermal paste cannot be applied such as cases with large air gaps or uneven surfaces GREAT RESULTS By filling small gaps with its flexible and highly conductive structure the Thermal Pad effectively dissipates heat between components 8WmK THERMAL CONDUCTIVITY With a highly conductive and versatile nature it is suitable for a wide range of configurations with basic to high requirements.